Manila Times Business
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and adopted Single-Side Copper Exposed (SSC) module pac
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