Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System

World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer lineOmni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications.Supports FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory marketsTAOYUAN, June 15, 2026 /PRNewswire/ -- A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, has successfully delivered the world's firs